ADOPTED_FROM:EN ISO 9453:2020 This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
NS-EN ISO 9453:2020 history
2020NS-EN ISO 9453:2020 Soft solder alloys — Chemical compositions and forms (ISO 9453:2020)
2014NS-EN ISO 9453:2014 Soft solder alloys — Chemical compositions and forms (ISO 9453:2014)
2007NS-EN ISO 9453:2006 Soft solder alloys — Chemical compositions and forms (ISO 9453:2006)