GB/Z 41275.4-2023
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 4: Ball Grid Array Ball Installation (English Version)
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GB/Z 41275.4-2023
Standard No.
GB/Z 41275.4-2023
Language
Chinese,
Available in English version
Release Date
2023
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Lastest
GB/Z 41275.4-2023
GB/Z 41275.4-2023 history
2023
GB/Z 41275.4-2023
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 4: Ball Grid Array Ball Installation
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