IEC 60249-2-13/AMD1:1993
IEC · 1993-05

Base materials for printed circuits; part 2: specifications; specification 13: flexible copper-clad polyimide film, general purpose grade; amendment 1

Replaced ICS 31.180

3Version History

IEC 60249-2-13:1987 older 1987
IEC 60249-2-13:1987/AMD1:1993 Amd 1/1993 1993

4Standard Metadata

Standard Number
IEC 60249-2-13/AMD1:1993
Status
Replaced
Publisher
International Electrotechnical Commission (IEC)
Publication Date
1993-05
ICS Classification
31.180 (Printed circuits and boards) 
Adopted Standard
DIN EN 60249-2-13-1994,IDT;EN 60249-2-13/A1-1994,IDT;prEN 60249-2-13/prA1-1993,IDT;NF C93-763-1995,IDT;OEVE EN 60249-2-13/A1-1996,IDT;UNE-EN 60249-2-13/A1-1996,IDT

5Citation Network

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6Frequently Asked Questions

What is IEC 60249-2-13/AMD1:1993?
IEC 60249-2-13/AMD1:1993 — Base materials for printed circuits; part 2: specifications; specification 13: flexible copper-clad polyimide film, general purpose grade; amendment 1 is an international standard developed by International Electrotechnical Commission (IEC).
What does IEC 60249-2-13/AMD1:1993 cover?
This standard covers:
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 60249-2-13/AMD1:1993?
The current published version is IEC 60249-2-13/AMD1:1993, published on 1993-05. Always check for amendments or pending revisions.
How do I purchase IEC 60249-2-13/AMD1:1993?
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