Environmental testing - Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2Scope / Description

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys.
This standard provides standard procedures for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
The procedures in this standard include the solder bath method and reflow method. The solder bath method is applicable to the SMD designed for flow soldering and the SMD designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMD for reflow soldering and when the solder bath (dipping) method is not appropriate.
The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-2 using each of the soldering methods specified in IEC 61760-1. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.