DIN EN 60191-6-16 E:2013-08
DIN · 2013-08

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

1Key Takeaways

DIN EN 60191-6-16 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA This standard applies to the glossary of semiconductor tests and burn-in sockets for Ball Grid Array (BGA), Land Grid Array (LGA), Fine Pitch Ball Grid Arra…

2Scope / Description

DIN EN 60191-6-16

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

This standard applies to the glossary of semiconductor tests and burn-in sockets for Ball Grid Array (BGA), Land Grid Array (LGA), Fine Pitch Ball Grid Array (FBGA), and Fine Pitch Land Grid Array (FLGA) devices. It provides definitions and mechanical standardization terms relevant to testing and burn-in sockets used in semiconductor packaging. The standard is intended for manufacturers, testing laboratories, and engineers involved in semiconductor device testing and reliability assessment.

3Version History

DIN EN 60191-6-16:2007 older 2007-11
DIN EN 60191-6-16 E:2013 Amd E/2013-01 older 2013-08-01
DIN EN 60191-6-16 E:2013-08 Amd E/2013-08 2013-08

5Citation Network

0
Cite this standard
4
Referenced herein
IEC 60191-1:1966 IEC 60191-2:1966 IEC 60191-3:1999 IEC 60191-4:1999

6Frequently Asked Questions

What is DIN EN 60191-6-16 E:2013-08?
DIN EN 60191-6-16 E:2013-08 — Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA is an international standard developed by German Institute for Standardization. DIN EN 60191-6-16 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA This standard applies to the glossary of semiconductor tests and burn-in sockets for...
What does DIN EN 60191-6-16 E:2013-08 cover?
This standard covers: DIN EN 60191-6-16 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA This standard applies to the glossary of semiconductor tests and burn-in sockets for Ball Grid Array (BGA), Land Grid Array (LGA), Fine...
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of DIN EN 60191-6-16 E:2013-08?
The current published version is DIN EN 60191-6-16 E:2013-08, published on 2013-08. Always check for amendments or pending revisions.
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