Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability...

2Scope / Description

This part of IEC 61249 contains requirements for the performance of prepregs primarily used in the manufacture of multilayer printed circuit boards (PCBs) according to IEC 62326-4 standards. The laminates used must conform to IEC 61249-2-39 standards. Multilayer PCBs made from these materials are suitable for lead-free assembly technologies. These prepregs can also be used to bond other types of laminates. Prepregs according to this standard have defined flammability (vertical burning test). The flammability rating of the prepreg after full curing is achieved by applying brominated flame retardant additives that are integral to the polymer structure. After curing according to the supplier's instructions, the glass transition temperature (Tg) of the prepreg must be at least 170°C.