EVS-EN IEC 60286-3:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

1Key Takeaways

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.This document also includes …

2Scope / Description

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

3Version History

5Citation Network

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6Frequently Asked Questions

What is EVS-EN IEC 60286-3:2022?
EVS-EN IEC 60286-3:2022 — Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes is an international standard developed by Estonian Centre for Standardisation. This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components...
What does EVS-EN IEC 60286-3:2022 cover?
This standard covers: This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.This...
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
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