Packaging of components for automatic handling; part 3: packaging of leadless components on continuous tapes

This technical specification defines the requirements for the automated packaging of components without leads onto continuous carriers. It outlines the necessary parameters and procedures to ensure that the components are securely placed and organized within the tape structure, facilitating efficient handling by automated assembly equipment. The document covers essential aspects such as the type of carrier materials, the spacing between components, the method of sealing, and the dimensional tolerances required for consistent performance. By establishing these guidelines, the standard aims to enhance the reliability of the packaging process and support the integration of surface mount technology in electronic manufacturing. It specifies how the continuous tape should be wound, packaged for storage, and transported to minimize damage and maintain component integrity. The provisions detailed herein serve as a reference for manufacturers and equipment designers to create systems that meet the demands of modern electronics production.