Base materials for printed circuits; part 2: specifications; specification No. 4: epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

This specification defines the technical requirements for copper-clad laminates made from epoxy resin with woven glass reinforcement, designed for use as base materials in printed circuit fabrication. The document outlines critical criteria regarding the physical and electrical properties necessary to ensure reliability in standard-grade applications. Key parameters covered include dimensional stability, dielectric characteristics, thermal performance, and mechanical strength under normal operating conditions. These requirements are established to guarantee compatibility with common manufacturing processes while maintaining the integrity of the substrate during subsequent assembly and service life. The text provides clear acceptance limits for various test methods used to evaluate the material's quality and consistency. It serves as a reference for manufacturers and suppliers to align their production with internationally recognized benchmarks for this specific class of laminates. By adhering to these guidelines, industry stakeholders can ensure uniformity in the supply chain and facilitate interoperability across different production facilities. The content focuses solely on the defining attributes and test protocols without addressing implementation timelines or the specific governing body behind the document's creation.