Epoxy resin-impregnated glass cloth (pre-preg) for multilayer printed circuits

This document establishes technical specifications and test methods for prepreg materials specifically designed for the manufacturing of multilayer printed circuit boards. It focuses on glass cloth-based epoxy resin systems used as the core layering substrate. The content defines the physical and chemical properties required for these materials to ensure reliability in complex electronic assemblies. Key parameters covered include dimensional stability, electrical insulation performance, moisture resistance, and thermal characteristics under various operating conditions. The standard outlines procedures for sample preparation and evaluation to verify conformity with the stipulated requirements. These criteria are intended to support consistent quality in the production of advanced circuitry used across diverse industrial applications. By providing a unified framework for material assessment, the document facilitates interchangeability and compatibility within the electronics supply chain. It serves as a reference for manufacturers and quality control personnel involved in the fabrication of high-density interconnection systems. The guidelines address critical aspects of material behavior during processing and final service life.