IEC 60191-6-13:2007
IEC · 2007-06

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline for open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Replaced ICS 31.080.01 ICS 31.240

1Key Takeaways

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in s…

2Scope / Description

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

3Version History

IEC 60191-6-13:2007 2007-06
IEC 60191-6-13:2016 newer 2016-09

4Standard Metadata

Standard Number
IEC 60191-6-13:2007
Status
Replaced
Publisher
International Electrotechnical Commission (IEC)
Publication Date
2007-06
Implementation
2016-09-29
ICS Classification
31.080.01 (Semiconductor devices in general)  31.240 (Mechanical structures for electronic equipment) 
Adopted Standard
DIN EN 60191-6-13-2008,IDT;BS EN 60191-6-13-2008,IDT;EN 60191-6-13-2007,IDT;NF C96-013-6-13-2008,IDT;C96-013-6-13PR,IDT;OEVE/OENORM EN 60191-6-13-2008,IDT;PN-EN 60191-6-13-2008,IDT

5Citation Network

0
Cite this standard
2
Referenced herein
Referenced by IEC 60191-6-13:2007
IEC 60191-2 IEC 60191-6:2004

6Frequently Asked Questions

What is IEC 60191-6-13:2007?
IEC 60191-6-13:2007 — Mechanical standardization of semiconductor devices - Part 6-13: Design guideline for open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) is an international standard developed by International Electrotechnical Commission (IEC). This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings...
What does IEC 60191-6-13:2007 cover?
This standard covers: This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of...
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 60191-6-13:2007?
The current published version is IEC 60191-6-13:2007, published on 2007-06. Always check for amendments or pending revisions.
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