Soldered electronic assemblies. Workmanship requirements. Part 3. Through-hole mount assemblies

This document specifies the process requirements for the assembly of through-hole mounted components used in welding electronic assemblies. It covers various aspects including materials selection, preparation of surfaces, welding techniques, quality control procedures, and inspection methods. The scope of the document is limited to through-hole components and does not include surface mount technology. It provides guidelines for ensuring the reliability and performance of welded joints in electronic circuits. The document outlines the necessary steps for the proper handling, storage, and application of components during the welding process. It also includes recommendations for the training of personnel involved in the assembly process. The information provided is intended to support the production of high-quality electronic assemblies that meet industry standards.