ISO 16525-9:2014
ISO · 2014-05

Adhesives - Test methods for isotropic electrically conductive adhesives - Part 9: Determination of high-speed signal-transmission characteristics

试验 ICS 83.180

1Key Takeaways

This part of ISO 16525 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates…

2Scope / Description

This part of ISO 16525 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on the printed circuit board.

3Version History

5Citation Network

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Referenced herein
IEC 60194:2006 IEC 61188-5-1:2002 IEC 61188-5-2:2003 IEC 61188-5-3:2007 IEC 61188-5-4:2007 IEC 61188-5-5:2007 IEC 61188-5-6:2003 IEC 61190-1-2:2014

6Frequently Asked Questions

What is ISO 16525-9:2014?
ISO 16525-9:2014 — Adhesives - Test methods for isotropic electrically conductive adhesives - Part 9: Determination of high-speed signal-transmission characteristics is an international standard developed by International Organization for Standardization (ISO). This part of ISO 16525 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and...
What does ISO 16525-9:2014 cover?
This standard covers: This part of ISO 16525 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board....
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of ISO 16525-9:2014?
The current published version is ISO 16525-9:2014, published on 2014-05. Always check for amendments or pending revisions.
How do I purchase ISO 16525-9:2014?
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