IEC TR 61189-3-914:2017
IEC · 2017-03

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

指南 ICS 31.180

3Version History

5Citation Network

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Referenced herein
EIA JESD 51-2A-2008 IEC 60068-1:2013 IEC 60194:2015 IEC 61189-3-913:2016

6Frequently Asked Questions

What is IEC TR 61189-3-914:2017?
IEC TR 61189-3-914:2017 — Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines is an international standard developed by International Electrotechnical Commission (IEC).
What does IEC TR 61189-3-914:2017 cover?
This standard covers:
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC TR 61189-3-914:2017?
The current published version is IEC TR 61189-3-914:2017, published on 2017-03. Always check for amendments or pending revisions.
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