IEC TR 61189-3-914:2017
IEC · 2017-03
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
指南
ICS 31.180
3Version History
IEC TR 61189-3-914:2017
2017-03
5Citation Network
0
Cite this standard
4
Referenced herein
Referenced by IEC TR 61189-3-914:2017
EIA JESD 51-2A-2008
IEC 60068-1:2013
IEC 60194:2015
IEC 61189-3-913:2016
6Frequently Asked Questions
What is IEC TR 61189-3-914:2017?
IEC TR 61189-3-914:2017 — Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines is an international standard developed by International Electrotechnical Commission (IEC).
What does IEC TR 61189-3-914:2017 cover?
This standard covers:
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC TR 61189-3-914:2017?
The current published version is IEC TR 61189-3-914:2017, published on 2017-03. Always check for amendments or pending revisions.
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