Base materials for printed circuits. Part 3 : Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

IEC 60249-3-1:1981 — Base materials for printed circuits. Part 3 : Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards is an international standard developed by International Electrotechnical Commission (IEC). Gives the requirements of properties of two types of epoxide resin impregnated woven glass fabric with the resin cured to a B-stage. They are used for bonding together printed circuits formed from metal-clad epoxide glass laminates to produce...

This standard covers: Gives the requirements of properties of two types of epoxide resin impregnated woven glass fabric with the resin cured to a B-stage. They are used for bonding together printed circuits formed from metal-clad epoxide glass laminates to produce multilayer

This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.

The current published version is IEC 60249-3-1:1981, published on 1981. Always check for amendments or pending revisions.

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