Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer CONSOLIDATED EDITION
1Key Takeaways
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements.…
2Expert Interpretation
This article provides an in-depth analysis of the IEC 60317-36:2013+AMD1:2019+AMD2:2024 CSV standard, covering the technical requirements, test methods, performance indicators, and application guidelines for Class 180 solderable polyesterimide enameled round copper wire, with a focus on the double-coat structure, thermal performance, and mechanical properties.
Standard Overview and Technical Background
IEC 60317-36 is Part 36 of the International Electrotechnical Commission's Specifications for Certain Types of Winding Wire, specifically addressing the technical requirements for Class 180 Solderable Polyesterimide Enameled Round Copper Wire. Originally published in 2013, the standard underwent two revisions in 2019 and 2024, resulting in the current consolidated version 2.2.
Core Technical Requirements of the Standard
This standard specifies the requirements for Class 180 Solderable Enameled Round Copper Wire with a double coating. The base coating is based on a polyesterimide resin and can be modified but must maintain the chemical properties of the original resin and meet all specified wire requirements. The overcoat is a bonding layer based on a thermoplastic resin.
| Performance Parameters | Grade 1B Requirements | Grade 2B Requirements | Test Methods |
|---|---|---|---|
| Conductor Diameter Range | 0.020-1.600mm | 0.020-1.600mm | IEC 60317-0-1 |
| Thermal Shock Temperature | ≥200°C | Clause 9 | |
| Temperature Index | ≥180 | Clause 15 | |
| Cut Resistance | No Failures for 2 Minutes at 265°C | Clause 10 | |
In-Depth Analysis of Key Performance Indicators
Electrical Performance Requirements
Clause 5 of the standard specifies electrical resistance requirements, which must comply with the requirements of IEC 60317-0-1:2013 and its amendments. For 180-grade enameled wire, electrical stability in high-temperature environments is crucial.
Mechanical Properties
Elongation (Clause 6), elasticity (Clause 7), flexibility, and adhesion (Clause 8) are all clearly specified. Of particular note, the rotation calculation constant K for the peel test is specified as 110 mm.
Thermal Performance
The thermal shock test requires a minimum temperature of 200°C, demonstrating the material's stability in high-temperature environments. The temperature index requirement is not less than 180, ensuring the long-term reliability of the winding wire in high temperature environments.
Detailed specifications for wear resistance
Clause 11 of the standard specifies the wear resistance requirements for nominal conductor diameters from 0.250mm to 1.600mm. For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter should be taken.
| Conductor diameter (mm) | Grade 1B Minimum average force (N) | Grade 1B Each measurement (N) | Grade 2B Minimum average force (N) | Grade 2BEach measurement value (N) |
|---|---|---|---|---|
| 0.250 | 2.85 | 2.45 | 4.70 | 4.00 | < /tr>
| 0.280 | 3.10 | 2.60 | 5.05 | 4.30 |
| 0.315 | 3.35 2.80 5.45 4.60 1.600 9.20 7.80 14.3 12.1 1.600 td> |
Solderability Technical Requirements Article 17 specifies the solderability requirements. The solder bath temperature should be (470 ± 5) °C. The surface of the tinned wire should be smooth, free of holes and paint residue.
For conductors of different diameters, the maximum immersion time requirements are different:
- Nominal conductor diameter ≤ 0.100mm: maximum immersion time 3 seconds
- Nominal conductor diameter > 0.100mm: Grade 1B is 12 seconds/mm, Grade 2B is 16 seconds/mm, minimum 3 seconds
Thermal bond or solvent bond requirements
Thermal bond strength
Clause 18.1 of the standard specifies the thermal bond strength requirements for spiral coils, including test requirements at room temperature and high and low temperature conditions.
| Conductor diameter range (mm) | Room temperature load (N) | High temperature load (N) |
|---|---|---|
| 0.050-0.071 | 0.05 | 0.04 |
| 0.071-0.100 | 0.08 | 0.06 |
| 1.400-1.600 | 8.50 | 6.40 |
Twisted Coil Bond Strength
Clause 18.1.2 is specifically for the bond strength test of twisted coils with a diameter of 0.315 mm, including specific requirements under room temperature and high and low temperature conditions.
Standard Implementation Recommendations and Application Guide
Material Selection Recommendations
When selecting 180 grade weldable polyesterimide enameled wire, the following factors should be considered:
- The maximum operating temperature of the application environment
- The required mechanical strength and wear resistance requirements
- The matching of welding process parameters
- The bonding performance requirements
Test Verification Points
During the implementation process, special attention should be paid to the accuracy of the following test items:
- Temperature control accuracy of thermal shock test
- Force calibration of wear resistance test /li>
- Time control of solderability test
- Sample preparation for bond strength test
Key points of quality control
Establish a complete quality control system, focusing on:
- Consistency control of raw materials
- Stability of production process parameters
- Comprehensive coverage of finished product testing
- Consistency of quality between batches
Technological evolution and development trends
From the first edition in 2013 to the revised edition in 2024, IEC The 60317-36 standard reflects the continued development of winding wire technology:
- Test method optimization: References to IEC 60317-0-1 are clearer and more standardized
- Requirement integration: Solderability requirements in clauses 17.1 and 17.2 have been integrated
- New test items: Pinhole test requirements have been added in clause 23
- Application guidance improvements: General instructions for winding wire in clause 3.2.2 have been added
These changes reflect the industry’s increased performance requirements for winding wire and improved test methods, providing manufacturers and users with clearer technical guidance.
Harmonization with other standards
IEC 60317-36 needs to be used in conjunction with the following standards:
- IEC 60317-0-1:2013 and its amendments: General requirements
- IEC 60851 series: Test methods
- IEC 60264 series: Packaging requirements
This standard system structure ensures the systematic and coordinated technical requirements, test methods and packaging specifications.