IEC 60317-36:2013
IEC · 2013-10

Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer

Replaced ICS 29.060.10

1Key Takeaways

This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin@ which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements.…

2Scope / Description

This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin@ which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE A modified resin is a resin that has undergone a chemical change@ or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this part is: ?C Grade 1B: 0@020 mm up to and including 1@600 mm; ?C Grade 2B: 0@020 mm up to and including 1@600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013.

3Version History

IEC 60317-36:1992 older 1992-06
IEC 60317-36:1992/AMD1:1997 Amd 1/1997 older 1997
IEC 60317-36:1992/AMD2:1999 Amd 2/1999 older 1999
IEC 60317-36:2000 older 2000-01-01
IEC 60317-36:2013/AMD1:2019 Amd 1/2019 newer 2019-06-12
IEC 60317-36:2019 newer 2019-06-12
IEC 60317-36:2013/AMD2:2024 Amd 2/2024 newer 2024-06-14
IEC 60317-36:2024 newer 2024-06-01

5Citation Network

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Cite this standard
3
Referenced herein
IEC 60264 IEC 60317-0-1:2013 IEC 60851

6Frequently Asked Questions

What is IEC 60317-36:2013?
IEC 60317-36:2013 — Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer is an international standard developed by International Electrotechnical Commission (IEC). This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin@ which may be modified providing it retains the chemical...
What does IEC 60317-36:2013 cover?
This standard covers: This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin@ which may be modified providing it retains the chemical identity of the original resin and meets all...
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 60317-36:2013?
The current published version is IEC 60317-36:2013, published on 2013-10. Always check for amendments or pending revisions.
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