IEC 62899-203:2024 RLV
IEC · 2024-05-28

Printed electronics - Part 203: Materials - Semiconductor ink

1Key Takeaways

Standard Name: Printed Electronics - Part 203: Materials - Semiconductor Ink Standard Number: IEC 203 Scope: This standard specifies the materials used in printed electronics, focusing on semiconductor inks. It covers the evaluation of properties such as solid content, non-volatile content, density, rheolo…

2Expert Interpretation

An in-depth interpretation of the IEC 62899-203:2024 international standard for semiconductor inks, covering material property evaluation, electrical performance testing, optical property analysis, and storage condition specifications, provides comprehensive technical guidance and quality control basis for the printed electronics industry.

Standard Overview and Technical Background

IEC 62899-203:2024 is a key standard for printed electronics published by the International Electrotechnical Commission. It specifically specifies the characteristic evaluation and test methods for semiconductor inks. The second edition of this standard, released in 2024, replaces the first edition published in 2018, reflecting the evolution of the standard amidst the rapid development of printed electronics technology.

Standard framework and main contents

This standard mainly consists of seven core chapters and two informative appendices, which comprehensively cover the complete evaluation system of semiconductor ink from raw materials to film-forming properties:

Chapter Content Overview Test Method Applicable Instruments
Chapter 5 Evaluation of semiconductor ink characteristics Solid content, rheology, surface tension, etc. Rotational viscometer, Surface tensiometer
Chapter 6 Semiconductor layer performance test Charge mobility, dielectric properties, optical properties

Solid content and non-volatile content tests are conducted in accordance with ISO 124 and ISO 3251 standard methods respectively:

  • Solid content: The total solid content in the ink is accurately determined by the 105°C oven drying method.
  • Non-volatile content: Determine the proportion of non-volatile components under specific temperature and time conditions

5.3 Physical property tests

Density test can adopt various methods such as ISO 758, ISO 1183-1, ISO 2811, etc.

Test items Standard method Accuracy requirements Temperature conditions
Density ISO 2811-1/2 ±0.001 g/cm³ 20±0.5°C
Rheological properties ISO 3219 Adjustable shear rate range 23±2°C
Surface tension ISO 304 ±0.1 mN/m 23±2°C

Innovations in electrical performance testing

6.3.1 Charge mobility measurement

Important updates to the 2024 version of the standard: Added 6.3.1.2.2 Normalized on-state current measurement method to improve the accuracy of TFT device performance evaluation:

  • Using field-effect transistor structure to test charge mobility
  • Normalization processing eliminates the influence of device size differences
  • Provides a standardized data processing process

6.3.2 Dielectric Properties Test

The dielectric constant calculation formula has been revised to ensure international comparability of the measurement results:

εr = C·d / (ε0·A)

Where C is the capacitance, d is the film thickness, A is the electrode area, and ε0 is the vacuum dielectric constant


Optical Properties Test System

6.4.2 Light Transmittance Test

According to ISO 13468-1:2019 and ISO 13468-2:1999, single-beam or dual-beam instrument is used for measurement:

  • Wavelength range: 380-780nm
  • Measurement accuracy: ±0.5%
  • Sample requirements: Surface flatness ≤0.1mm

6.4.4

Appendix B provides a detailed test point distribution scheme to ensure the representativeness of the evaluation results:

Sample size Number of test points Distribution pattern Allowable deviation
≤100cm² 5 points Center+four corners ΔE≤3.0
100-400cm² 9 points 3×3 grid ΔE≤2.5
≥400cm² 13 points 5 point center + 8 point edge ΔE≤2.0

Storage and aging test specifications

7.2 Storage condition requirements

The standard specifies the recommended storage conditions for semiconductor inks:

  • Temperature: 15-25°C
  • Relative humidity: 30-60%
  • Store away from light and avoid direct sunlight
  • Keep sealed container to prevent solvent volatilization

7.3 Aging degradation assessment

Appendix A provides a detailed ink aging assessment method:

  • Accelerated aging conditions: 40°C/75%RH
  • Evaluation cycles: 0, 7, 14, 28 days
  • Performance indicators: Viscosity change rate ≤ 15%
  • Electrical performance: Mobility decrease rate ≤ 20%

Standard implementation recommendations

Laboratory configuration requirements

To meet the standard testing requirements, the laboratory should be equipped with the following equipment:

  • High-precision balance: accuracy 0.0001g, used for solid content testing
  • Rheometer: shear rate range 0.1-1000s⁻¹
  • Surface tensiometer: Wilhelmy plate method or Du Noüy ring method
  • Semiconductor parameter analyzer: used for TFT characteristic testing

Quality control system

Establish a semiconductor ink quality control system based on this standard:

  1. Raw material incoming inspection: Conduct physical property tests in accordance with the requirements of Chapter 5
  2. Production process monitoring: Real-time monitoring of key parameters such as viscosity and surface tension
  3. Finished product performance verification: Conduct electrical and optical performance tests in accordance with the requirements of Chapter 6
  4. Storage stability assessment: Conduct aging tests regularly to ensure stable performance within the product’s shelf life

Technology Development Trends

With the rapid development of printed electronics technology, semiconductor ink standards will face the following challenges and development directions:

  • Demand for test methods for higher mobility materials
  • Test requirements for bending stability in flexible display applications
  • New characterization techniques for nanomaterial inks
  • Evaluation standards for environmentally friendly solvent systems

IEC 62899-203:2024 provides comprehensive technical specifications and test methods for semiconductor inks used in printed electronics, which is of great significance to promoting industry standardization, improving product quality, and facilitating technological innovation. It is recommended that relevant companies actively adopt this standard, establish a complete quality control system, and enhance product competitiveness.

3Version History

IEC 62899-203:2018 older 2018-09-00

5Citation Network

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Cite this standard
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Referenced herein
IEC 62860 ISO 1183-1 ISO 124 ISO 13468-1:2019 ISO 13468-2:1999 ISO 13655 ISO 14488 ISO 14782

6Frequently Asked Questions

What is IEC 62899-203:2024 RLV?
IEC 62899-203:2024 RLV — Printed electronics - Part 203: Materials - Semiconductor ink is an international standard developed by International Electrotechnical Commission (IEC). Standard Name: Printed Electronics - Part 203: Materials - Semiconductor Ink Standard Number: IEC 203 Scope: This standard specifies the materials used in printed electronics, focusing on semiconductor inks. It covers the evaluation of properties...
What does IEC 62899-203:2024 RLV cover?
This standard covers: Standard Name: Printed Electronics - Part 203: Materials - Semiconductor Ink Standard Number: IEC 203 Scope: This standard specifies the materials used in printed electronics, focusing on semiconductor inks. It covers the evaluation of properties such as solid content, non-volatile content,...
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 62899-203:2024 RLV?
The current published version is IEC 62899-203:2024 RLV, published on 2024-05-28. Always check for amendments or pending revisions.
How do I purchase IEC 62899-203:2024 RLV?
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