Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections - Ceramic enclosures
1Key Takeaways
This part of IEC 61837 deals with the standard overview and pin connections for surface mount devices (SMDs) in frequency control and selection, for surface mount devices in ceramic packages. It is based on IEC 61240:2016.
2Expert Interpretation
Comprehensive technical guide to BS EN IEC 61837-2:2018+A1:2020 standard for surface-mounted piezoelectric devices in ceramic enclosures. Covers 45 enclosure types, dimensional specifications, terminal configurations, and compliance with IEC 61240:2016 for frequency control applications.
Introduction to IEC 61837-2 Standard
The BS EN IEC 61837-2:2018+A1:2020 standard specifies requirements for surface-mounted piezoelectric devices in ceramic enclosures used for frequency control and selection. This UK-implemented standard supersedes BS EN IEC 61837-2:2018 and incorporates Amendment 1:2020 changes.
Key Technical Specifications
| Parameter | Dual Chip Carrier (DCC) | Quad Chip Carrier (QCC) |
|---|---|---|
| Terminal Arrangement | Width/length side or corner (A/B/C) | Side only or side+corner (A/B) |
| Lead Count | 2-8 leads | 6-18 leads |
| Package Sizes | 1.2×1.0mm to 9.0×7.0mm | 3.0×3.0mm to 18.0×9.0mm |
| Height (G) | 0.35-2.30mm | 1.10-2.00mm |
Technical Evolution
Key changes in 2020 amendment:
- Added 7 new enclosure types including DCC-6/5032A and DCC-4/1210C
- Revised drawings to align with IEC 61240:2016 notation
- Expanded terminal connection guidelines for crystal oscillators and SAW devices
Implementation Guidelines
When applying this standard:
- Verify dimensional tolerances match Sheet specifications (typically ±0.2mm)
- Note orientation markers (increased LB dimensions on specific leads)
- Cross-reference with IEC 61240 for general SMD outline rules
- Consult Table 1 for enclosure type-to-sheet number mapping
Common Applications
- QCC-18/1809A for high-precision frequency control systems
- DCC-4/1210C in compact IoT devices
- QCC-8/3030B for automotive electronics
Compliance Considerations
The standard references multiple IEC documents including:
- IEC 61240:2016 (SMD outline preparation)
- IEC 60368 series (piezoelectric filters)
- IEC 60862 series (SAW devices)
Manufacturers should ensure:
- Ceramic material meets thermal expansion requirements
- Terminal land patterns accommodate reflow soldering processes
- Markings comply with orientation identification requirements