Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures

This standard outlines specifications for surface-mounted piezoelectric devices used in band control and selection applications. It focuses on the physical dimensions and terminal connections of these devices, specifically addressing ceramic encapsulated units. The document provides detailed requirements for the design and construction of such components to ensure consistency and interoperability within electronic systems. It includes guidelines for material selection, dimensional tolerances, and testing procedures. The standard is structured to support manufacturers and users in achieving reliable performance and compatibility in high-frequency applications. It also covers marking and packaging requirements to facilitate proper identification and handling during production and use.