Draft Document - Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-gla...

DIN EN 61249-4-19 E:2010 — Draft Document - Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-gla... is an international standard developed by German Institute for Standardization. This document is part of a series that specifies materials for printed circuit boards and other interconnection structures. It focuses on the detailed requirements for unclad prepreg materials made from high-performance, non-halogenated epoxy resin...

This standard covers: This document is part of a series that specifies materials for printed circuit boards and other interconnection structures. It focuses on the detailed requirements for unclad prepreg materials made from high-performance, non-halogenated epoxy resin with E-glass reinforcement, used in the...

This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.

The current published version is DIN EN 61249-4-19 E:2010, published on 2010-12-01. Always check for amendments or pending revisions.

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