Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined

2Scope / Description

This part of IEC 61249 specifies requirements for the properties of prepregs primarily intended for use as adhesive films in the manufacture of multilayer printed circuit boards (PCBs) according to IEC 62326-4 from laminates according to IEC 61249-2-40. PCBs manufactured from these materials are suitable for lead-free assembly. However, these prepregs can also be used for bonding other laminate types. Prepregs conforming to this standard exhibit a defined flammability rating (burn test with the sample in a vertical position). The flammability rating of fully cured prepregs is achieved by the use of halogen-free flame retardants incorporated as an integral part of the polymer structure. After curing the prepreg according to the supplier's instructions, the glass transition temperature must be at least 170 °C.