Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020 / Note: DIN EN IEC 61837...
1Key Takeaways
This part of IEC 61837 is based on IEC 61240:2016 and describes standard package dimensions and terminals as they apply to surface mountable devices (SMDs) for frequency stabilization and selection in ceramic packages.
2Expert Interpretation
An in-depth interpretation of the DIN EN IEC 61837-2:2021 standard's technical requirements for ceramic packaging of surface-mounted piezoelectric devices, including dimensional specifications, terminal connection standards, and typical application scenario analysis for 47 package types. It is suitable for the design and manufacture of electronic components for frequency control and selection.
Analysis of the Standard's Core Content
DIN EN IEC 61837-2:2021-06 is based on IEC 61240:2016 and specifically specifies the ceramic package dimensions and connection terminal requirements for surface mount devices (SMDs) used for frequency control and selection. This standard replaces DIN EN IEC 61837-2:2019-02, with a transition period until October 29, 2023.
Packaging Architecture
| Configuration Type | Number of Terminals | Typical Dimensions (mm) | Application Characteristics |
|---|---|---|---|
| DCC (Dual Chip Carrier) | 2-8 Terminals | 1.0×0.8 to 12.0×5.5 | Frequency Stabilization Devices |
| QCC (Quad Chip Carrier) | 6-18 Terminals | 3.0×3.0 to 18.0×9.0 | Complex Filtering Circuits |
Key Technology Updates
Main changes in the 2021 version:
- Two new package types, DCC-8/3225A and DCC-4/1008C
- Optimize the mechanical dimension tolerance of the existing package structure
- Clarify the directional identification rules for the terminal LB size
Comparison of typical package parameters
Take QCC-8/5050A as an example:
| External dimensions | 5.0×5.0mm (nominal) |
| Terminal spacing | 1.27mm |
| Terminal length LB | 1.0-1.4mm |
| Application scenarios | SAW filter/crystal oscillator |
Implementation recommendations
- During the design phase, the 47 standard packages listed in the standard should be given priority.
- For micro packages such as DCC-4/2016C, special attention should be paid to soldering process control.
- For high-frequency applications, it is recommended to select the QCC series package with a shielded design.
Standard Evolution Analysis
This standard has been revised four times in 2001, 2012, 2014, and 2019. The 2021 version mainly responds to the following technical requirements:
- Requirements for ultra-miniaturized packaging for 5G equipment
- Automotive electronics' demand for high-reliability terminals
- Smart manufacturing's stringent requirements for standardized dimensions