Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020
1Key Takeaways
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240. This document is a modified version of existing types with the ad
2Expert Interpretation
An in-depth analysis of the technical requirements for surface-mount piezoelectric device ceramic packaging in the DIN EN IEC 61837-2:2021 standard, including dimensional tolerances, pin configurations, and frequency control application guidelines for 47 package types, covering the compliance requirements of the DCC/QCC packaging system and IEC 61240.
Overview of the core content of the standard
DIN EN IEC 61837-2:2021, as an important part of the IEC 61837 series of standards, specifically regulates the ceramic packaging technical indicators of surface-mounted piezoelectric devices. This standard replaces the 2019 edition. The main updates include:
- Added two new package types, DCC-8/3225A and DCC-4/1008C
- Optimized the dimensional tolerance system of existing package structures
- Clearly defined the transition period to October 29, 2023
Packaging Technical Parameter Comparison
| Parameters | DCC Series | QCC Series | Test Standards |
|---|---|---|---|
| Number of Pins | 2-8 Pins | 6-18 Pins | IEC 61240 |
| Typical Dimension Tolerance | ±0.2mm | ±0.3mm | ISO 1101 |
| Operating Temperature | -40~+85℃ | -40~+125℃ | IEC 60679-1 |
Details of Key Package Types
DCC-4/3225C Typical Application
This 4-pin ceramic package (3.2×2.5mm) is widely used for 32.768kHz clock crystals. Its technical features include:
- Pin pitch: 2.20mm (e1)
- Height tolerance: 0.70±0.25mm
- Metalization layer thickness ≥0.1μm
Standard Evolution Analysis
Compared with the 2011 version of the standard, this update mainly reflects three major technical improvements:
- Introduction of laser welding process requirements
- Refined pin plating thickness detection method
- Added dimensional chain control for micro packages (such as 1.0×0.8mm)
Implementation Recommendations
Design Phase
It is recommended to give priority to the preferred package sizes listed in the standard, for example:
- High frequency applications: QCC-8/5050A (5.0×5.0mm)
- Micro devices: DCC-4/1008C (1.0×0.8mm)
Production Control
Key Quality Control Points:
- Ceramic substrate warpage ≤0.1mm/10mm
- Pin coplanarity ≤0.05mm
- Soldering temperature profile complies with IEC 61190 standard