IEC 60191-3:1999
IEC · 1999-10

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

ICS 01.100.25 ICS 31.240 Cited by 5

1Key Takeaways

This part of IEC 60191 gives guidance on the preparation of drawings of integrated circuit outlines.

2Scope / Description

This part of IEC 60191 gives guidance on the preparation of drawings of integrated circuit outlines.

3Version History

IEC 60191-3:1974 older 1974
IEC 60191-3:1974/AMD1:1983 Amd 1/1983 older 1983
IEC 60191-3:1974/AMD2:1995 Amd 2/1995 older 1995
IEC 60191-3:1974/AMD2:1995/COR1:1996 Amd 2/1995 older 1996
IEC 60191-3:1999 1999-10

4Standard Metadata

Standard Number
IEC 60191-3:1999
Status
Current (70% confidence)
Publisher
International Electrotechnical Commission (IEC)
Publication Date
1999-10
Implementation
1999-11-10
ICS Classification
01.100.25 (Electrical and electronics engineering drawings)  31.240 (Mechanical structures for electronic equipment) 
Adopted Standard
DIN EN 60191-3-2000,IDT;BS EN 60191-3-2000,IDT;EN 60191-3-1999,IDT;NF C96-013-3-2000,IDT;SN EN 60191-3-1999,IDT;OEVE/OENORM EN 60191-3-2000,IDT;PN-EN 60191-3-2002,IDT;UNE-EN 60191-3-2001,IDT

5Citation Network

5
Cite this standard
3
Referenced herein
Standards that cite IEC 60191-3:1999
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 / Note: To be replaced by DIN EN 60191-6-16 (2013-...
Referenced by IEC 60191-3:1999
IEC 60191-1:1966 IEC 60191-4:1999 ISO 2692:1988

6Frequently Asked Questions

What is IEC 60191-3:1999?
IEC 60191-3:1999 — Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits is an international standard developed by International Electrotechnical Commission (IEC). This part of IEC 60191 gives guidance on the preparation of drawings of integrated circuit outlines.
What does IEC 60191-3:1999 cover?
This standard covers: This part of IEC 60191 gives guidance on the preparation of drawings of integrated circuit outlines.
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 60191-3:1999?
The current published version is IEC 60191-3:1999, published on 1999-10. Always check for amendments or pending revisions.
How do I purchase IEC 60191-3:1999?
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