IEC 61190-1-2:2014
IEC · 2014-02
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
1Key Takeaways
This part of IEC 61190 specifies the general requirements for the characterization and testing of solder paste used in electronic assembly to manufacture high-quality electronic interconnects. This standard is a quality control document and is not intended to directly address the performance of materials during the man…
2Scope / Description
This part of IEC 61190 specifies the general requirements for the characterization and testing of solder paste used in electronic assembly to manufacture high-quality electronic interconnects. This standard is a quality control document and is not intended to directly address the performance of materials during the manufacturing process. For information on flux characterization, quality control, and procurement documentation for solder paste and flux-containing materials, please refer to IEC 61190-1-1.
3Version History
5Citation Network
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Cite this standard
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Referenced herein
Standards that cite IEC 61190-1-2:2014
Adhesives - Test methods for isotropic electrically conductive adhesives - Part 9: Determination of high-speed signal-transmission characteristics
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Printed board assemblies. Part 1. Surface mount and related assembly technologies. Generic specification
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Referenced by IEC 61190-1-2:2014
IEC 60194:2006
IEC 61189-5-3
IEC 61190-1-1:2002
IEC 61190-1-3:2007
ISO 9454-2:1998
6Frequently Asked Questions
What is IEC 61190-1-2:2014?
IEC 61190-1-2:2014 — Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly is an international standard developed by International Electrotechnical Commission (IEC). This part of IEC 61190 specifies the general requirements for the characterization and testing of solder paste used in electronic assembly to manufacture high-quality electronic interconnects. This standard is a quality control document and is not...
What does IEC 61190-1-2:2014 cover?
This standard covers: This part of IEC 61190 specifies the general requirements for the characterization and testing of solder paste used in electronic assembly to manufacture high-quality electronic interconnects. This standard is a quality control document and is not intended to directly address the performance of...
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 61190-1-2:2014?
The current published version is IEC 61190-1-2:2014, published on 2014-02. Always check for amendments or pending revisions.
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