Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs

IEC 61189-3-913:2016 — Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs is an international standard developed by International Electrotechnical Commission (IEC). This part of IEC 61189 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high- brightness LEDs with surface mounted LEDs or with device...

This standard covers: This part of IEC 61189 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high- brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs).

This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.

The current published version is IEC 61189-3-913:2016, published on 2016-01. Always check for amendments or pending revisions.

You can purchase IEC 61189-3-913:2016 by visiting our contact page. Click "Get This Standard" to view pricing and send a purchase inquiry. Our team will respond with payment and delivery details.