IEC 60194:1999
IEC · 1999-04
Printed board design, manufacture and assembly - Terms and definitions
1Key Takeaways
This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
2Scope / Description
This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
3Version History
5Citation Network
40
Cite this standard
0
Referenced herein
Standards that cite IEC 60194:1999
Materials for printed boards and other interconnecting structures. Part 2-2. Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, copper-clad and high electrical grade
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (v
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
Detail specification - Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75101-801, with assessed quality; German version EN 175101-809:2004 / Note: DIN EN 175101-809 (2000-09) remains valid alongsid...
Environmental testing - Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
6Frequently Asked Questions
What is IEC 60194:1999?
IEC 60194:1999 — Printed board design, manufacture and assembly - Terms and definitions is an international standard developed by International Electrotechnical Commission (IEC). This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
What does IEC 60194:1999 cover?
This standard covers: This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 60194:1999?
The current published version is IEC 60194:1999, published on 1999-04. Always check for amendments or pending revisions.
How do I purchase IEC 60194:1999?
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