IEC 60191-6:2009
IEC · 2009-11
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
1Key Takeaways
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8@ as well as integrated circuits classified as for…
2Scope / Description
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8@ as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
3Version History
5Citation Network
7
Cite this standard
3
Referenced herein
Standards that cite IEC 60191-6:2009
Piezoelectric devices- Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2015); German version EN 61837-3:2015 / Note: DIN EN 61837-3 (2001-09) remains valid alo...
Referenced by IEC 60191-6:2009
IEC 60191-1:2007
IEC 60191-4:2002
ISO 1101:2004
6Frequently Asked Questions
What is IEC 60191-6:2009?
IEC 60191-6:2009 — Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages is an international standard developed by International Electrotechnical Commission (IEC). This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of...
What does IEC 60191-6:2009 cover?
This standard covers: This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8@ as well as integrated...
Who should use this standard?
This standard is intended for organizations, professionals, and stakeholders involved in various industries and sectors. It is applicable to manufacturers, service providers, regulatory bodies, and certification organizations.
What is the latest version of IEC 60191-6:2009?
The current published version is IEC 60191-6:2009, published on 2009-11. Always check for amendments or pending revisions.
How do I purchase IEC 60191-6:2009?
You can purchase IEC 60191-6:2009 by visiting our contact page. Click "Get This Standard" to view pricing and send a purchase inquiry. Our team will respond with payment and delivery details.